Henkel Hysol - Chemical Components
When it comes to advances in semiconductor packaging technologies and mold compounds, Henkel's widely acclaimed Hysol line of products is without compare.
Through years of dedicated research and expertise gained from practical, in-field applications, the Hysol portfolio has amassed a full suite of materials solutions for modern semiconductor and electronics packaging processes. From the most innovative die attach materials formulations to liquid encapsulants to package level underfills and low-stress, high strength mold compounds for semiconductor and optoelectronics applications, the products that fall under the Hysol brand are synonymous with reliability, performance, cost effectiveness and ease-of-use.
| Henkel, headquartered in Düsseldorf, Germany, has about 55,000 employees worldwide and is among the most internationally aligned German-based companies in the global marketplace. People in approximately 125 countries around the world trust in brands and technologies from Henkel.
In 1999, Henkel Corporation acquired The Dexter Corporation and has continued the unrivalled product development and leading-edge manufacturing solutions that have been associated with the Hysol brand name since its inception.