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Henkel Hysol - Chemical Components

When it comes to advances in semiconductor packaging technologies and mold compounds, Henkel's widely acclaimed Hysol line of products is without compare.

Through years of dedicated research and expertise gained from practical, in-field applications, the Hysol portfolio has amassed a full suite of materials solutions for modern semiconductor and electronics packaging processes. From the most innovative die attach materials formulations to liquid encapsulants to package level underfills and low-stress, high strength mold compounds for semiconductor and optoelectronics applications, the products that fall under the Hysol brand are synonymous with reliability, performance, cost effectiveness and ease-of-use.

Hysol Adhesive Distributor Henkel, headquartered in Düsseldorf, Germany, has about 55,000 employees worldwide and is among the most internationally aligned German-based companies in the global marketplace. People in approximately 125 countries around the world trust in brands and technologies from Henkel.

In 1999, Henkel Corporation acquired The Dexter Corporation and has continued the unrivalled product development and leading-edge manufacturing solutions that have been associated with the Hysol brand name since its inception.

Products:

  • Coatings
  • Molding
  • Potting & Encapsulating
   
Hysol Coatings: Hysol manufactures Epoxy Molding Compounds, Insulating Coating Powders and Optically Clear Molding Compounds, Hysol compounds.

A layer of a substance applied onto a surface for protection or to enhance visual aesthetics, Once molded and post-mold cured, this product provides optimum protection and reliability for these semiconductor devices.
 
Hysol Molding : Specialty thermoset epoxy compounds delivered with processing and end-use technical support. SolEpoxy is a global manufacturer, high-tech specialist innovator of epoxy dielectric coating powders and molding compounds, plus a unique, optically clear epoxy molding compound.

To create a shape or form using powder or liquids.
 
Hysol Potting & Encapsulating: Three styles of adhesive are generally used for structural bonding applications: epoxies, acrylics, and urethanes. Adhesive selection depends on what materials are to be bonded, operating environment and process specifications.

Compounds used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect components from the exposure to chemicals, moisture, mechanical shock and vibration.
 
Hysol Adhesives Characteristics: Loctite Hysol 9430 is a two-part modified epoxy structural adhesive that attains structural properties after a room temperature cure. It is formulated to give a combination of very high peel strength along with excellent shear strength. The tough, flexible nature of this adhesive makes it a perfect choice for bonding dissimilar materials including aluminum, carbon fiber, fiberglass, steel, stainless, etc. and for assemblies with clearances (bond line thicknesses) of up to 0.100". Often used by custom builders for assembly of carbon fiber bicycle frames, (Trek, for example) Hysol Adhesive is convenient to use and easy to cure while developing tensile strengths up to 5,300 psi, shear strength of 4,700 psi and a modulus of elasticity of 380,000 psi.
 
 
Hysol Adhesives Specifications:Hysol Products
Hysol Structural Bonding Solutions

Hysol Selector Guide