IBS Electronics

Component Division

Printed Circuit Board Manufacturing:

Printed Circuit Board Manufacturer - 2000-IBS Electronics is Global source for Electronic parts and components IBS Electonics Printed Circuit Board Manufacturing. Printed circuit boards are fascinating things. From a complex multi-layer board to a double sided surface mount design, our goal is to provide you a quality product that meets your requirements and is the most cost effective to manufacture.

We offer high-quality printed circuit boards fabrication, assembly and parts sourcing services supplier. Since our establishment, we have helped thousands of engineers, and purchasers from businesses. We do our best to ensure our PCBs meet and exceed specific requirements of each and every one of our customers.

Printed circuit boards may not be the most expensive components your business purchases, but they are certainly among the most important. The capabilities and performance of the electronics you manufacture is directly dependent on the capabilities and performance of the circuit boards inside, which means the success of your products (and ultimately your business) is linked to the PCBs you order.

IBS Electonics preserves its position in the market of high mix low/medium volume with fast delivery to produce high quality level of printed circuit board up to 20 layers. The notion of "Speed” is echoed throughout the whole company management activities. "Service Beyond Expectation" is our persistent customer service philosophy. Fast and on time delivery with high quality is the advantage and characteristic of the competition. IBS Electronics Circuits gets the U.S. UL Safety Certificate (UL File No: E301546) including normal FR4 material, aluminum base and high-frequency Rogers material and has the perfect ISO9001 Quality Management System approved by SGS. In addition our products meet the RoHS standard certified by the SGS.

IBS Electronics offers High quality Printed Circuit Board fabrication and assembly.
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate.

IBS ELECTRONICS Circuits Technical Specification

Seq

Item

Technical Specification

Remarks

Standard

Advanced

1

Number of Layer

1-10 Layers

12-16 Layers

 

2

Base Material

FR4(High TG), Teflon, Rogers, Aluminum Based

 

3

Finish Board Thickness

0.30 mm ~ 3.20 mm
(8 mil ~ 126 mil)

0.20 mm ~ 4.5 mm
(5 mil ~ 177 mil)

 

4

Minimum Core Thickness

0.15mm(6 mil)

0.10mm ( 4 mil)

 

5

Copper Thickness

Min. 1/2 OZ, Max. 4 OZ

Min. 1/3 OZ, Max. 6 OZ

Selective Area
Available,
Thicker Cu On
Request

6

Min.Trace
Wide&Line 
Space

Single Sided

0.13 mm ( 5 mil )

0.10mm ( 4 mil)

 

Double Sided

0.13 mm ( 5 mil )

0.10mm ( 4 mil)

 

7

Min. Hole
Diameter

Drilling /PTH

f0.20 mm ( 8 mil )

f0.20 mm ( 8 mil )

 

Punching

f1.0 mm ( 40 mil )

f0.90 mm ( 36 mil )

If Necessary

8

Dimension
Tolerance

Hole Position

0.08 ( 3 mil )

 

Conductor Width(W)

20% Deviation of Master
 A/W

1mil Deviation of Master
A/W

 

Hole Diameter(H)

NPTH:+/-0.05 mm ( 2 mil )

NPTH:+/-0.05 mm ( 2 mil )

 

PTH: +/-0.075 mm ( 3 mil )

PTH: +/-0.05 mm ( 2 mil )

 

Outline Dimension

0.13 mm ( 5 mil )

0.10 mm ( 4 mil )

 

Conductors & Outline
( C - O )

0.15 mm ( 6 mil )

0.13 mm ( 5 mil )

 

Warp and Twist

0.75%

0.50%

 

9

Surface Treatment On Land Area

Leadfree HASL, Entek, Immersion Silver, Immersion 
Tin, Golden Finger, OSP

 

10

V-Cutting

Panel Size

457.2mm X 622 mm      
( max. )

457.2mm X 800 mm
( max. )

 

Board Thickness

0.50 mm (20mil) min.

0.30 mm (12mil) min.

 

Remain Thickness

1/3 board thickness

0.40 +/-0.10mm
( 16+/-4 mil )

 

Tolerance

±0.13 mm(5mil)

±0.1 mm(4mil)

 

Groove Width

0.50 mm (20mil) max.

0.38 mm (15mil) max.

 

Groove to Groove

20 mm (787mil) min.

10 mm (394mil) min.

 

Groove to Trace

0.45 mm(18mil) min.

0.38 mm(15mil) min.

 

11

Slot

Slot size tol.L=2W

PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil)

PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)

(1)L=Length of slot (2)W=Width of slot (3)Min.drill bit size     for multi-hit is
0.60mm

NPTH slot(mm) L+/-0.10
(4mil) W:+/-0.05(2mil)

NPTH slot(mm) L:+/-0.08
(3mil) W:+/-0.05(2mil)

12

Min Spacing
from hole
edge to
hole edge

0.30-1.60
(Hole Diameter)

0.15mm(6mil)

0.10mm(4mil)

 

1.61-6.50
(Hole Diameter)

0.15mm(6mil)

0.13mm(5mil)

 

13

Minimum spacing between hole edge
to circuitry pattern

PTH hole: 0.20mm(8mil)

PTH hole: 0.13mm(5mil)

 

NPTH hole: 0.18mm(7mil)

NPTH hole: 0.10mm(4mil)

 

14

Image transfer
Registration tol

Circuit pattern vs.
index hole

0.10(4mil)

0.08(3mil)

 

Circuit patten vs.2nd
drill hole

0.15(6mil)

0.10(4mil)

 

15

Registration tolerance of front/back
image

0.075mm(3mil)

0.05mm(2mil)

 

16

Multilayers

Layer-layer
misregistration

4layers:

0.15mm(6mil)
max.

4layers:

0.10mm(4mil)
max.

 
6layers:

0.20mm(8mil)
max.

6layers:

0.13mm(5mil)
max.

 
8layers:

0.25mm(10mil)
max.

8layers:

0.15mm(6mil)
max.

 

Min.Spacing From
Hole Edge
 to Innerlayer Pattern

0.225mm(9mil)

0.15mm(6mil)

 

Min.Spacing From Outline to
Innerlayer Pattern

0.38mm(15mil)

0.225mm(9mil)

 

Min. board thickness

4layers:0.30mm(12mil)

4layers:0.20mm(8mil)

 

6layers:0.60mm(24mil)

6layers:0.50mm(20mil)

 

8layers:1.0mm(40mil)

8layers:0.75mm(30mil)

 

Board thickness
tolerance

4layers:+/-0.13mm(5mil)

4layers:+/-0.10mm(4mil)

 

6layers:+/-0.15mm(6mil)

6layers:+/-0.13mm(5mil)

 

8-12 layers:+/-0.20mm
(8mil)

8-12 layers:+/-0.15mm
(6mil)

 

17

Insulation Resistance

10KO~20MO(typical:5MO)

 

18

Conductivity

<50O(typical:25O)

 

19

Test voltage

250V

 

20

Impedance control

Typical: 50O+/-10%

 



IBS Electonics Turnkey Manufacturing

PCB
  • Single sided PCBA using a single sided PCB, as well as double-sided assemblies using PCBs of 2 to 20+ layers. We pride ourselves in taking care of complex projects consisting of high technology, multi-layer boards.
  • Rigid or flex PCBAs.
  • Any cable harnesses or wiring that may be required for certain product assemblies. We may outsource the production of these items, but Assembly House, Inc. will work with you to conveniently meet all of your Printed Circuit Board assembly requirements.
IBS works with PCB blanks made from:
  • FR4 consisting of various laminates. (For low temperatures: tin or lead. For high temperatures: lead free.)
  • CEM-1 Composite material composed of woven glass fabric surfaces and paper core combined with epoxy resin (as is typical in the Printed Circuit Board industry). CEM-1 provides excellent mechanical and electrical properties, and punches well up to .093”.
  • Our board finishes vary with product and component technology levels. For lower level product technology - Printed Circuit Boards are assembled without fine pitch or BGA
  • component technology - we typically use HASL (Hot Air Solder Leveling). For high level product technology - Printed Circuit Boards are assembled with fine pitch or BGA - we usually specify ENIG (Electroless Nickel Immersion Gold) or IAg (Immersion Silver).
IBS Electronics PCB team prefers complete documentation to provide an accurate quote:
  • A BOM (Bill of Materials) with reference designators: component description, manufacturer’s name and part number.
  • PCB Gerber files.
  • A PCB fabrication drawing and PCBA assembly drawing.
  • Test procedures.
  • Any mechanical restrictions such as assembly height requirements.