Bergquist Henkel

The Bergquist Company | Henkel Corporation

Bergquist-logo Bergquist, based in Chanhassen, MN, USA, supplies thermal-management solutions for electronic applications, serving a variety of industries ranging from automotive to consumer and industrial electronics as well as LED lighting, in North America, Asia-Pacific and Europe.

Sep 18, 2014 : Henkel acquired The Bergquist Company
Electronics Group of Henkel
Innovation, performance and customer satisfaction are Henkel's guiding principles. Today, Henkel supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates.

Image of Henkel Bergquist Gap Pad HC 5.0Gap Pad HC 5.0

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.

Publish Date: 2016-08-11
Image of Bergquist's TCF 4000 PXF Bridgelux Qualified Thermal PadsTCF 4000 PXF Bridgelux Qualified Thermal Pads

Bergquist's TCF 4000 PXF phase-change thermal interface material is a reworkable material suitable for use between heat-sinks and other heat dissipating components.

Image of Bergquist's Sil-Pad® 900SSil-Pad® 900S

The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.

Image of Bergquist's Q-Pad® 3Q-Pad® 3

Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.

Image of Bergquist's Gap Pad® 1500Gap Pad® 1500

Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.

Image of Bergquist's Sil-Pad® K-10Sil-Pad® K-10

The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.

Image of Bergquist's Gap Pad® VO Ultra SoftGap Pad® VO Ultra Soft

Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.

Image of Bergquist's Gap Pad® VO UltimateGap Pad® VO Ultimate

Gap Pad® VO Ultimate for both small and large gap designs features thermal conductivity of 1.3 W/m-K and ultra conformability.

Bergquist Selection Guides
Bergquist Comprehensive Sil-Pad Selection Guide

Bergquist Comprehensive Thermal Clad Selection Guide

Bergquist Thermal Solutions Selection Guide

Bergquist LED Thermal Solutions Brochure

Bergquist HeatSeal Membrane Switch Catalog