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 Printed Circuit Board (PCB) manufacturing is a complex and essential process in the electronics industry. PCBs are the foundational components used in virtually all electronic devices, providing a platform for connecting and supporting various electronic components.
IBS Electonics Printed Circuit Board Manufacturing Service: Printed circuit boards are fascinating things. From a complex multi-layer board to a double sided surface mount design, our goal is to provide you a quality product that meets your requirements and is the most cost effective to manufacture.
As a trusted supplier, we provide a comprehensive range of services including high-quality printed circuit board (PCB) fabrication, assembly, and parts sourcing. Throughout our years of operation, we have successfully assisted numerous engineers and purchasers from a wide array of businesses. Our commitment lies in ensuring that every PCB we deliver not only meets but exceeds the specific requirements of each individual customer. With a focus on excellence, we strive to consistently deliver outstanding results and unmatched customer satisfaction.
We offer high-quality printed circuit boards fabrication, assembly and parts sourcing services supplier. Since our establishment, we have helped thousands of engineers, and purchasers from businesses. We do our best to ensure our PCBs meet and exceed specific requirements of each and every one of our customers.
Printed circuit boards may not be the most expensive components your business purchases, but they are certainly among the most important. The capabilities and performance of the electronics you manufacture is directly dependent on the capabilities and performance of the circuit boards inside, which means the success of your products (and ultimately your business) is linked to the PCBs you order.
IBS Electonics preserves its position in the market of high mix low/medium volume with fast delivery to produce high quality level of printed circuit board up to 20 layers. The notion of "Speed” is echoed throughout the whole company management activities. "Service Beyond Expectation" is our persistent customer service philosophy. Fast and on time delivery with high quality is the advantage and characteristic of the competition. IBS Electronics Circuits gets the U.S. UL Safety Certificate (UL File No: E301546) including normal FR4 material, aluminum base and high-frequency Rogers material and has the perfect ISO9001 Quality Management System approved by SGS. In addition our products meet the RoHS standard certified by the SGS.
IBS Electronics offers High quality Printed Circuit Board fabrication and assembly.
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate.
| IBS ELECTRONICS Circuits Technical Specification |
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Seq
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Item
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Technical Specification
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Remarks
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Standard
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Advanced
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1
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Number of Layer
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1-10 Layers
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12-16 Layers
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2
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Base Material
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FR4(High TG), Teflon, Rogers, Aluminum Based
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3
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Finish Board Thickness
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0.30 mm ~ 3.20 mm
(8 mil ~ 126 mil)
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0.20 mm ~ 4.5 mm
(5 mil ~ 177 mil)
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4
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Minimum Core Thickness
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0.15mm(6 mil)
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0.10mm ( 4 mil)
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5
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Copper Thickness
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Min. 1/2 OZ, Max. 4 OZ
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Min. 1/3 OZ, Max. 6 OZ
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Selective Area
Available,
Thicker Cu On
Request
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6
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Min.Trace
Wide&Line
Space |
Single Sided
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0.13 mm ( 5 mil )
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0.10mm ( 4 mil)
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Double Sided
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0.13 mm ( 5 mil )
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0.10mm ( 4 mil)
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7
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Min. Hole
Diameter
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Drilling /PTH
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f0.20 mm ( 8 mil )
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f0.20 mm ( 8 mil )
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Punching
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f1.0 mm ( 40 mil )
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f0.90 mm ( 36 mil )
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If Necessary
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8
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Dimension
Tolerance
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Hole Position
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0.08 ( 3 mil )
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Conductor Width(W)
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20% Deviation of Master
A/W
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1mil Deviation of Master
A/W
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Hole Diameter(H)
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NPTH:+/-0.05 mm ( 2 mil )
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NPTH:+/-0.05 mm ( 2 mil )
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PTH: +/-0.075 mm ( 3 mil )
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PTH: +/-0.05 mm ( 2 mil )
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Outline Dimension
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0.13 mm ( 5 mil )
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0.10 mm ( 4 mil )
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Conductors & Outline
( C - O )
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0.15 mm ( 6 mil )
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0.13 mm ( 5 mil )
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Warp and Twist
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0.75%
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0.50%
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9
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Surface Treatment On Land Area
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Leadfree HASL, Entek, Immersion Silver, Immersion
Tin, Golden Finger, OSP
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10
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V-Cutting
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Panel Size
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457.2mm X 622 mm
( max. )
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457.2mm X 800 mm
( max. )
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Board Thickness
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0.50 mm (20mil) min.
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0.30 mm (12mil) min.
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Remain Thickness
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1/3 board thickness |
0.40 +/-0.10mm
( 16+/-4 mil )
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Tolerance
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±0.13 mm(5mil)
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±0.1 mm(4mil)
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Groove Width
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0.50 mm (20mil) max.
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0.38 mm (15mil) max.
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Groove to Groove
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20 mm (787mil) min.
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10 mm (394mil) min.
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Groove to Trace
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0.45 mm(18mil) min.
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0.38 mm(15mil) min.
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11
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Slot
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Slot size tol.L=2W
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PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil)
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PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
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(1)L=Length of slot (2)W=Width of slot (3)Min.drill bit size for multi-hit is
0.60mm
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NPTH slot(mm) L+/-0.10
(4mil) W:+/-0.05(2mil)
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NPTH slot(mm) L:+/-0.08
(3mil) W:+/-0.05(2mil)
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12
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Min Spacing
from hole
edge to
hole edge
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0.30-1.60
(Hole Diameter)
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0.15mm(6mil)
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0.10mm(4mil)
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1.61-6.50
(Hole Diameter)
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0.15mm(6mil)
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0.13mm(5mil)
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13
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Minimum spacing between hole edge
to circuitry pattern
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PTH hole: 0.20mm(8mil)
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PTH hole: 0.13mm(5mil)
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NPTH hole: 0.18mm(7mil)
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NPTH hole: 0.10mm(4mil)
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14
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Image transfer
Registration tol
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Circuit pattern vs.
index hole
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0.10(4mil)
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0.08(3mil)
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Circuit patten vs.2nd
drill hole
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0.15(6mil)
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0.10(4mil)
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15
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Registration tolerance of front/back
image
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0.075mm(3mil)
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0.05mm(2mil)
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16
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Multilayers
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Layer-layer
misregistration
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4layers: |
0.15mm(6mil)
max.
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4layers:
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0.10mm(4mil)
max.
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| 6layers: |
0.20mm(8mil)
max.
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6layers:
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0.13mm(5mil)
max.
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| 8layers: |
0.25mm(10mil)
max.
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8layers:
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0.15mm(6mil)
max.
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Min.Spacing From
Hole Edge
to Innerlayer Pattern
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0.225mm(9mil)
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0.15mm(6mil)
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Min.Spacing From Outline to
Innerlayer Pattern
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0.38mm(15mil)
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0.225mm(9mil)
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Min. board thickness
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4layers:0.30mm(12mil)
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4layers:0.20mm(8mil)
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6layers:0.60mm(24mil)
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6layers:0.50mm(20mil)
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8layers:1.0mm(40mil)
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8layers:0.75mm(30mil)
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Board thickness
tolerance
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4layers:+/-0.13mm(5mil)
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4layers:+/-0.10mm(4mil)
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6layers:+/-0.15mm(6mil)
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6layers:+/-0.13mm(5mil)
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8-12 layers:+/-0.20mm
(8mil)
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8-12 layers:+/-0.15mm
(6mil)
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17
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Insulation Resistance
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10KO~20MO(typical:5MO)
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18
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Conductivity
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<50O(typical:25O)
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19
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Test voltage
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250V
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20
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Impedance control
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Typical: 50O+/-10%
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IBS Electonics Turnkey Manufacturing
PCB
- Single sided PCBA using a single sided PCB, as well as double-sided assemblies using PCBs of 2 to 20+ layers. We pride ourselves in taking care of complex projects consisting of high technology, multi-layer boards.
- Rigid or flex PCBAs.
- Any cable harnesses or wiring that may be required for certain product assemblies. We may outsource the production of these items, but Assembly House, Inc. will work with you to conveniently meet all of your Printed Circuit Board assembly requirements.
IBS works with PCB blanks made from:
- FR4 consisting of various laminates. (For low temperatures: tin or lead. For high temperatures: lead free.)
- CEM-1 Composite material composed of woven glass fabric surfaces and paper core combined with epoxy resin (as is typical in the Printed Circuit Board industry). CEM-1 provides excellent mechanical and electrical properties, and punches well up to .093”.
- Our board finishes vary with product and component technology levels. For lower level product technology - Printed Circuit Boards are assembled without fine pitch or BGA
- component technology - we typically use HASL (Hot Air Solder Leveling). For high level product technology - Printed Circuit Boards are assembled with fine pitch or BGA - we usually specify ENIG (Electroless Nickel Immersion Gold) or IAg (Immersion Silver).
IBS Electronics PCB team prefers complete documentation to provide an accurate quote:
- A BOM (Bill of Materials) with reference designators: component description, manufacturer’s name and part number.
- PCB Gerber files.
- A PCB fabrication drawing and PCBA assembly drawing.
- Test procedures.
- Any mechanical restrictions such as assembly height requirements.
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