UA-3307-B ZYMET | Components Distributor

UA-3307-B Details / Availability

UA-3307-B Summary: UA-3307-B from ZYMET is uA-3307-B Zymet Reworkable Edgebond Adhesive Enhances Board Level Reliability of Large WLCSP

Details

Part Number: UA-3307-B
Description : uA-3307-B Zymet Reworkable Edgebond Adhesive Enhances Board Level Reliability of Large WLCSP
Manufacturer: ZYMET
Category: Chemicals
Quantity Avail: 102
Price: Request for Quote

ZYMET

- Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants.

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ISO 9001:2015 & AS9120 IBS Electronics distributes genuine Electronic Components UA-3307-B ua-3307-b zymet reworkable edgebond adhesive enhances board level reliability of large wlcsp. We currently maintain an inventory with a wide array of components. These include ICs, Discrete Components, Capacitors, Resistors, Connectors, Relays, Crystals, Ocillators, Inductors; as well as Mil-Spec, Industrial Grade, Commercial Grade, Hard-to-Find and Obsolete components. We also have the ability and industry connections to source globally.

IBS Electronics Quality Assurance

Quality Systems Registrar, NQA Global Accredited Certification Body, certified IBS Electronics to ISO standards. Our systems and compliance to the standards have been, and continue to be, regularly reviewed and tested to maintain continuous conformance.

ISO Certification

ISO registration gives you assurance that IBS Electronics's systems are accurate, comprehensive and conform to the rigorous requirements of the ISO standard. These requirements ensure IBS Electronics's long-term commitment to continuous improvements.