IBS Electronics: IC Failure Analysis

IBS Electronics Service

IC Failure AnalysisIn all development states of an integrated circuit (ICs): from prototype to production, failure analysis plays a critical role for success. Even a minor failure of signal integrity within the IC circuitry can have costly, time-consuming repercussions.

The first phase involves the detection of faulty signals at the bonding pad or chip level, either on prototype or production wafers or from field returns of a failed device. Defects originate from causes such as functional failures, internal opens/shorts, or current leakage. In all cases, electrical probing of the ICs on wafer or package level is essential to identify the faulty electrical condition. Probe systems provide the means to rapidly and accurately identify and analyze faults, in even the most advanced circuitry. Open platform probe stations like PM8, PA200, Summit 12000 or PA300 are excellent solutions for such applications due to their flexibility and modularity.

IBS Electronics, Inc. is pleased to announce its Semiconductor Failure Analysis, Reliability and Environmental testing services. The following are a short list of our services:

Failure Analysis

  • I/V characterization (curve trace)
  • Microprobing
  • Optical microscopic examination
  • Chemical or mechanical decapsulation
  • Real time X-ray
  • Scanning Acoustic Microscopy (C-SAM)
  • Scanning Electron Microscopy (SEM) systems
  • Energy Dispersive X-ray analysis (EDX)
  • Emission Microscopy
  • Hot spot analysis
  • Chemical Deprocessing
  • Plasma etching
  • Parallel lapping
  • Cross sectioning
  • Ball Shear / Bond Pull

Reliability and Environmental Tests

  • High Temperature Operating Life
  • Temperature Humidity Bias testing
  • Highly Accelerated Stress Bias Testing (HAST)
  • Temperature Cycling
  • Preconditioning per JEDEC-A113, all levels
  • Low Temperature Burn-in
  • Thermal Shock
  • Autoclave (Pressure Cooker) testing
  • High Temperature Storage
  • Vapor phase/air convection simulation
  • Scanning Acoustic Microscopy analysis (C-SAM)
  • Mark permanency
  • Solderability
  • High Power Burn-in
  • ESD & Latch up

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IC Failure Analysis