CN-1751-4 Details / Availability
CN-1751-4 Summary: CN-1751-4 from Zymet is Zymet CN-1751-4 reworkable underfill encapsulant that is extraordinarily crack resistant to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.
Details
Part Number: CN-1751-4
Description : Zymet CN-1751-4 reworkable underfill encapsulant that is extraordinarily crack resistant to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.
Manufacturer: Zymet
Category: Chemicals
Datasheet: Click here for Datasheet I
Quantity Avail: rfq
Price: Request for Quote
Zymet
- Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants.Related Components for CN-1751-4
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IBS Electronics distributes genuine Zymet CN-1751-4 zymet cn-1751-4 reworkable underfill encapsulant that is extraordinarily crack resistant to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.. We currently maintain an inventory with a wide array of components. These include ICs, Discrete Components, Capacitors, Resistors, Connectors, Relays, Crystals, Ocillators, Inductors; as well as Mil-Spec, Industrial Grade, Commercial Grade, Hard-to-Find and Obsolete components. We also have the ability and industry connections to source globally.