ZYMET Components Distributor
About Zymet
: Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants.Zymet Distributor
IBS Electronics is an electronic component distributor of interconnect, power and electromechanical products, capacitors, transistors, resistors, diodes, fuses, integrated circuits ICs, plus a diversity electronic, electrical, and electromechanical components and assemblies.Zymet Components - Inventory
| CN-1453 | Zymet CN-1453 is a new reworkable BGA underfill encapsulant. It is a silica filled version. | Zymet | rfq |
| CN-1703 | Zymet CN-1703 is designed for CSP and BGA encapsulation. CSP�s and BGA�s are not normally encapsulated. However it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations. | Zymet | rfq |
| CN-1728 | Zymet CN-1728 reworkable underfill encapsulant designed to underfill Package-on-Package (POP) | Zymet | rfq |
| CN-1735 | Zymet CN-1735 is designed to enhance the board level thermal cycle performance of IC packages with pitches as fine as 0.3- mm pitch. CN-1735 will also enhance ruggedness for drop and bend test performance. | Zymet | rfq |
| CN-1736 | Zymet CN-1736 is designed to enhance the drop test reliability of 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility making it suitable for use with a broader range of solder pastes and tacky fluxes. | Zymet | rfq |
| CN-1751-4 | Zymet CN-1751-4 reworkable underfill encapsulant that is extraordinarily crack resistant to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies. | Zymet | rfq |
| CSP-1412 | Zymet CSP-1412 is designed for BGA CSP and WL-CSP encapsulation. These packages are not typically encapsulated. However it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations. | Zymet | rfq |
| TC-601.1 | Ultra-low stress die attach adhesive for stress sensitive devices | Zymet | 1 |
| UA-2605 | uA-2605 Zymet Reworkable Edgebond Adhesive | ZYMET | 441 |
| UA-2605-B | uA-2605-B Zymet Reworkable Edgebond Adhesive | ZYMET | 192 |
| UA-2605-B-30ML | uA-2605-B Zymet Reworkable Edgebond Adhesive 30cc Syringe | ZYMET | 94 |
| UA-2625-B-30ML | uA-2625-B Zymet Reworkable Edgebond Adhesive for LTS Assembly of Very Large Packages 30cc Syringe | ZYMET | 36 |
| UA-3307-B | uA-3307-B Zymet Reworkable Edgebond Adhesive Enhances Board Level Reliability of Large WLCSP | ZYMET | 102 |
| UVE-1017-2 | Zymet UVE-1017-2 cuResistor in as little as 3 minutes far less time than a conventional heat cured encapsulant. The fast cure increases line speed and productivity. | Zymet | rfq |