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CSP-1412 Details / Availability


CSP-1412 Summary: CSP-1412 from Zymet is Zymet CSP-1412 is designed for BGA CSP and WL-CSP encapsulation. These packages are not typically encapsulated. However it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.
Details

Zymet-encapsulant.jpg Part Number:  CSP-1412
Description :  Zymet CSP-1412 is designed for BGA CSP and WL-CSP encapsulation. These packages are not typically encapsulated. However it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.
Manufacturer: Zymet
Category: Chemicals
Datasheet: Click here for Datasheet I
Quantity Avail:  rfq
Price: Request for Quote

Zymet

- Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants.


Related Components for CSP-1412

CSP-1412 Zymet zymet csp-1412 is designed for bga csp and wl-csp encapsulation. these packages are not typically encapsulated. however it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.

Disclaimer: Our inventory list is frequently updated. However, parts are committed on a first come first serve basis. To ensure that the parts are available, please contact us.

ISO 9001:2015 & AS9120 IBS Electronics distributes genuine Zymet  CSP-1412  zymet csp-1412 is designed for bga csp and wl-csp encapsulation. these packages are not typically encapsulated. however it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.. We currently maintain an inventory with a wide array of components. These include ICs, Discrete Components, Capacitors, Resistors, Connectors, Relays, Crystals, Ocillators, Inductors; as well as Mil-Spec, Industrial Grade, Commercial Grade, Hard-to-Find and Obsolete components. We also have the ability and industry connections to source globally.

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